As transistor scaling meets physical and economic limits, heterogeneous integration of memory, logic, and emerging materials is critical for sustaining performance and enabling next-generation computing. The demand for energy-efficient, scalable systems is accelerating with the rise of edge AI, advanced sensing, and data-centric technologies. However, integrating emerging memories and nanomaterials with CMOS platforms presents persistent challenges that limit manufacturability, scalability, and system reliability. Our group focuses on design and manufacturing of next-generation of computing architectures and AI chips through nonstructural innovation, low-temperature integration strategies, and 3D heterogeneous stacking techniques. By bridging device-level breakthroughs with system-aware design,we seek to enable manufacturable, energy-efficient semiconductor platforms, while exploring opportunities to interface emerging memory architectures with photonic interconnects for next-generation high-bandwidth, intelligent systems.